Atomic Bonding, Crystal Structures & Crystallography
How atoms arrange themselves. Learn atomic bonding (metallic, ionic, covalent, secondary) and bond energy curves, crystalline vs amorphous solids, unit cells and lattices, the common metallic structures (BCC, FCC, HCP) with coordination numbers and packing factors, theoretical density, allotropy (α-Fe, γ-Fe), Miller indices for directions and planes, linear and planar density, slip systems, single crystals vs polycrystals and anisotropy, and X-ray diffraction with Bragg's law — with Python computing densities, packing factors and XRD peak positions.
Most metals and ceramics are crystalline: atoms repeat in a regular 3D pattern. The pattern (crystal structure) controls density, how easily layers slide (ductility), and how the material diffracts X-rays.
Iron changes from BCC to FCC when heated above 912 °C — this allotropic change is the basis of heat-treating steel.
An analogy
Crystal structures are like ways of stacking oranges at a fruit stall: some stacks pack tightly (FCC, HCP — 74% of space filled), others leave more gaps (BCC — 68%). Tightly packed layers slide over each other more easily, making metals like copper and aluminium very ductile.
Bonding
Bond types and consequences:
- Metallic — sea of delocalised electrons: conductive, ductile, shiny
- Ionic — electrostatic attraction (NaCl, Al₂O₃): hard, brittle, insulating
- Covalent — shared electrons (diamond, Si, SiC): very hard, high melting
- Secondary (van der Waals, hydrogen bonds) — between polymer chains: low melting, soft
- Bond energy curve: equilibrium spacing at minimum energy; deep, sharp wells → high melting point and stiffness
BCC, FCC and HCP
FCC (Cu, Al, Ni, Au, γ-Fe, austenitic stainless): CN 12, APF 0.74, 12 slip systems on {111} planes — ductile even at low temperature. BCC (α-Fe, Cr, W, Mo): CN 8, APF 0.68 — strong, with a ductile-to-brittle transition at low temperature. HCP (Ti, Mg, Zn): CN 12, APF 0.74 but few easy slip systems — limited ductility at room temperature.
Miller indices
Directions [uvw]: vector components reduced to smallest integers. Planes (hkl): take reciprocals of intercepts on the axes, clear fractions. Families {hkl} and ⟨uvw⟩ group equivalent planes/directions. Slip happens on the most densely packed planes along the most densely packed directions (FCC {111}⟨110⟩, BCC {110}⟨111⟩).
Polycrystals, anisotropy and diffraction
Most engineering metals are polycrystalline — many grains with different orientations separated by grain boundaries; random texture makes them nearly isotropic, while rolling creates texture (used in electrical steels and deep-drawing sheet). Single crystals (turbine blades, silicon wafers) exploit anisotropy. Amorphous solids (glass, many polymers, metallic glasses) lack long-range order. XRD identifies phases, lattice parameters, texture and residual stress; peak broadening gives crystallite size.
Formulas
- Theoretical density:
ρ = nA/(V_c·N_A), V_c = a³ (cubic) - BCC / FCC geometry:
BCC: a = 4R/√3; FCC: a = 2√2·R - Packing factors:
APF: SC 0.52, BCC 0.68, FCC & HCP 0.74 - Cubic interplanar spacing:
d_hkl = a/√(h² + k² + l²) - Bragg's law:
nλ = 2d·sin θ - FCC reflections:
h, k, l all odd or all even (111, 200, 220…)
Worked example: Atomic radius from lattice parameter
Given: Cu FCC, a = 0.3615 nm
Find: R.
- R = a/(2√2)
Answer: 0.128 nm
Worked example: Miller indices
Given: Plane intercepts x = 1, y = ½, z = ∞
Find: (hkl).
- Reciprocals 1, 2, 0
Answer: (120)
Worked example: Bragg angle
Given: d = 0.2087 nm, λ = 0.15406 nm
Find: 2θ.
- sin θ = 0.15406/(2 × 0.2087) = 0.369
- θ = 21.66°
Answer: 43.3°
Density, packing factor and XRD peaks
import math
# Crystal structures: density, atomic packing factor and XRD peak positions
NA = 6.022e23
for name, n, a_nm, M in (("alpha-Fe (BCC)", 2, 0.2866, 55.85), ("Cu (FCC)", 4, 0.3615, 63.55), ("Al (FCC)", 4, 0.4050, 26.98)):
a = a_nm * 1e-7 # cm
rho = n * M / (NA * a ** 3)
print(f"{name:15s}: density {rho:.2f} g/cm3")
print(f"APF: BCC = {math.pi*math.sqrt(3)/8:.3f}, FCC = {math.pi/(3*math.sqrt(2)):.3f}")
# First XRD peaks of Cu (FCC: h,k,l all odd or all even) with Cu K-alpha
lam, a = 0.15406, 0.3615
for hkl in ((1, 1, 1), (2, 0, 0), (2, 2, 0)):
d = a / math.sqrt(sum(i * i for i in hkl))
print(f"Cu {hkl}: d = {d:.4f} nm, 2-theta = {2*math.degrees(math.asin(lam/(2*d))):.2f} deg")
# alpha-Fe (BCC) : density 7.88 g/cm3
# Cu (FCC) : density 8.94 g/cm3
# Al (FCC) : density 2.70 g/cm3
# APF: BCC = 0.680, FCC = 0.740
# Cu (1, 1, 1): d = 0.2087 nm, 2-theta = 43.32 deg
# Cu (2, 0, 0): d = 0.1807 nm, 2-theta = 50.45 deg
# Cu (2, 2, 0): d = 0.1278 nm, 2-theta = 74.13 degKnowing only the crystal structure, lattice parameter and atomic mass, we predict densities matching handbook values (iron 7.87, copper 8.96, aluminium 2.70 g/cm³). The XRD peak positions are the fingerprint used to identify phases in real samples — copper's strongest peak at 2θ ≈ 43.3° is the (111) plane.
Common mistakes
- Wrong: Assuming all metals are equally ductile. — Right: FCC ductile; BCC can embrittle cold; HCP limited.
- Wrong: Confusing [uvw] directions and (hkl) planes. — Right: Brackets differ; in cubic, [hkl] ⊥ (hkl).
- Wrong: Using wrong atoms per cell. — Right: BCC 2, FCC 4, HCP 6 (hexagonal cell).
Applications
- Phase identification: XRD in quality control labs.
- Single-crystal turbine blades: Removing grain boundaries for creep resistance.
- Electrical steels: Texture for low magnetic losses.
- Semiconductor wafers: Orientation-specific processing (100), (111).
Key takeaways
- Bonding sets stiffness, melting and ductility.
- FCC/HCP APF 0.74; BCC 0.68.
- ρ = nA/(a³N_A); d = a/√(h² + k² + l²).
- XRD fingerprints crystal structures.
Going further
- Reciprocal lattice: Diffraction and electron band structure.
- Texture analysis: Pole figures and EBSD.
- Quasicrystals: Ordered but non-periodic structures.