Formula Reference, Comparison Tables & Glossary
Everything in one place. Formula cards for semiconductor physics (np = n_i², σ, ρ, J_drift, L = √(Dτ)), PN junctions (V_bi, W, diode equation), BJTs (I_E = I_C + I_B, β, α, g_m), MOSFETs (region-specific equations), thermal (T_J = T_A + Pθ_JA), CMOS (P = αCV²f) and optoelectronics (photon energy, responsivity, QE, solar efficiency) — each with symbols, units, assumptions and validity; engineering comparison tables (conductor/semiconductor/insulator, intrinsic/extrinsic, N/P, drift/diffusion, PN/Schottky, Zener/avalanche, BJT/JFET/MOSFET, NPN/PNP, enhancement/depletion, NMOS/PMOS, planar/FinFET/GAA, Si/SiC/GaN, MOSFET/IGBT, SCR/TRIAC/GTO/IGCT, LED/laser, PN/PIN/APD, solar cell/photodiode, SRAM/DRAM/flash, bulk/SOI, wire bond/flip-chip, conventional/advanced packaging); a searchable glossary; and a Python formula self-check.
Use this lesson as a quick reference while working through the course or designing. Every formula here is explained in its lesson — this page collects them with their assumptions so they are not misused.
Try the self-check: compute each value by hand, then compare with the verified Python output.
An analogy
This lesson is the course's toolbox lid with every tool outlined: find the formula quickly, but remember which job each tool is designed for (its assumptions and validity range).
Glossary A–D
Key terms:
- Acceptor — group-III dopant creating holes (p-type)
- Avalanche — breakdown by impact ionisation
- Bandgap — energy gap between valence and conduction bands
- Band bending — spatial variation of band edges near junctions/surfaces
- BJT — bipolar junction transistor
- Breakdown — sudden current rise at high reverse voltage
- Carrier concentration / lifetime — number density / average survival time of carriers
- CMOS — complementary NMOS + PMOS technology
- Conductivity — σ = q(nµ_n + pµ_p)
- Depletion — region stripped of free carriers; Diffusion; Doping; Drift
Glossary E–M
More terms:
- Electron affinity — energy from E_c to vacuum
- Epitaxy — crystalline layer growth on a substrate
- Fermi level — energy with 50% occupation probability
- FinFET / GAA — multi-gate transistor architectures
- Fowler-Nordheim tunnelling — field-assisted tunnelling through oxides
- HEMT / HBT — high-electron-mobility / heterojunction bipolar transistor
- Hole — missing electron acting as positive carrier
- Ion implantation — accelerated-ion doping; Junction; Leakage; Lithography
- Majority / minority carrier — the more / less abundant carrier type
- MOS capacitor; MOSFET; Mobility — velocity per unit field
Glossary O–W
And the rest:
- Oxidation — thermal growth of SiO₂
- Photolithography — optical pattern transfer
- PN junction — boundary between p- and n-type regions
- Recombination — annihilation of electron–hole pairs
- Schottky — metal–semiconductor rectifying contact
- Semiconductor — material with controllable conductivity
- SOI — silicon-on-insulator
- Subthreshold — weak-inversion conduction below V_T
- Threshold voltage — gate voltage for strong inversion
- Transconductance — ∂I_out/∂V_in; Wafer; Wide-bandgap (SiC, GaN)
Comparison tables in the course
Conductor/semiconductor/insulator (Materials), intrinsic/extrinsic and N/P (Doping), drift/diffusion (Transport), PN/Schottky (Metal–semiconductor), Zener/avalanche (Breakdown), signal/power diodes (Diode families, Power fundamentals), BJT/JFET/MOSFET and NPN/PNP (below), enhancement/depletion and NMOS/PMOS (MOSFET operation), planar/FinFET/GAA and bulk/SOI (FinFET lesson), Si/SiC/GaN (Wide bandgap), MOSFET/IGBT (Power MOSFETs & IGBTs), SCR/TRIAC/GTO/IGCT (Thyristors), LED/laser (LEDs & lasers), PN/PIN/APD and solar/photodiode (Photodetectors), SRAM/DRAM/flash (Memory), wire bond/flip-chip and conventional/advanced packaging (Packaging). Values depend on device and process — tables give typical ranges.
Formulas
- Semiconductor:
np = n_i² (equilibrium, non-degenerate); σ = q(nµ_n + pµ_p); ρ = 1/σ; J = q(nµ_n + pµ_p)E; L = √(Dτ) - PN junction:
V_bi = V_T ln(N_AN_D/n_i²); W = √(2ε(V_bi + V_R)/q·(1/N_A + 1/N_D)); I = I_S(e^(V/nV_T) − 1) - BJT:
I_E = I_C + I_B; β = I_C/I_B; α = I_C/I_E; g_m = I_C/V_T (forward active) - MOSFET (long channel):
Triode: µC_ox(W/L)[(V_GS − V_T)V_DS − V_DS²/2]; Sat: ½µC_ox(W/L)(V_GS − V_T)²(1 + λV_DS) - Thermal & CMOS:
T_J = T_A + P·θ_JA; P_dyn ≈ αCV²f - Optoelectronics:
E = 1240/λ(nm) eV; R = ηλ(µm)/1.24 A/W; η_solar = P_mp/(G·A)
Worked example: Minority holes
Given: N_D 10¹⁶, n_i 9.65 × 10⁹
Find: p₀.
- n_i²/N_D
Answer: ≈ 9.3 × 10³ cm⁻³
Worked example: Photon energy
Given: λ 1310 nm
Find: E.
- 1240/1310
Answer: 0.947 eV
Worked example: α from β
Given: β 99
Find: α.
- 99/100
Answer: 0.99
Formula-card format
┌──────────────────────────────────────────────────────────────┐
│ Formula: V_bi = V_T ln(N_A N_D / n_i²) │
│ Symbols: V_T = kT/q, N_A/N_D doping (cm⁻³), n_i intrinsic │
│ Units: volts │
│ Assumes: abrupt junction, non-degenerate doping, equilibrium│
│ Example: N_A = N_D = 10¹⁶ → 0.716 V (n_i 9.65e9) │
│ Validity: fails for degenerate doping (> ~10¹⁹ cm⁻³) │
└──────────────────────────────────────────────────────────────┘Every formula in the course should be read with its symbols, units, assumptions, an example and its limits. Misapplying a formula outside its validity (e.g. square law in short channels, Boltzmann statistics in degenerate material) is the most common source of wrong answers.
Formula self-check
import math
# Formula self-check: core semiconductor-device values
q, k, T = 1.602e-19, 1.380649e-23, 300.0
VT = k * T / q
checks = {
"thermal voltage VT (mV)": VT * 1e3,
"n-type Si 1e16: p0 (cm^-3)": (9.65e9) ** 2 / 1e16,
"Vbi for Na=Nd=1e16 (V)": VT * math.log(1e32 / 9.65e9 ** 2),
"resistivity n=1e16, mu=1180 (ohm*cm)": 1 / (q * 1e16 * 1180),
"diffusion length D=12, tau=10us (um)": math.sqrt(12 * 10e-6) * 1e4,
"BJT gm at 1 mA (mA/V)": 1e-3 / VT * 1e3,
"Cox for 2 nm SiO2 (uF/cm^2)": 3.9 * 8.854e-14 / 2e-7 * 1e6,
"photon energy at 850 nm (eV)": 1240 / 850,
"Tj: 50 C + 3 W x 20 C/W": 50 + 3 * 20,
"CMOS power 0.1*1nF*1V^2*1GHz (W)": 0.1 * 1e-9 * 1 * 1e9,
}
for kname, v in checks.items():
print(f"{kname:40s} {v:12.4g}")
# thermal voltage VT (mV) 25.85
# n-type Si 1e16: p0 (cm^-3) 9312
# Vbi for Na=Nd=1e16 (V) 0.7162
# resistivity n=1e16, mu=1180 (ohm*cm) 0.529
# diffusion length D=12, tau=10us (um) 109.5
# BJT gm at 1 mA (mA/V) 38.68
# Cox for 2 nm SiO2 (uF/cm^2) 1.727
# photon energy at 850 nm (eV) 1.459
# Tj: 50 C + 3 W x 20 C/W 110
# CMOS power 0.1*1nF*1V^2*1GHz (W) 0.1Work each value out by hand first: V_T 25.85 mV, p₀ ≈ 9300 cm⁻³, V_bi 0.716 V, ρ 0.53 Ω·cm, L 110 µm, g_m 38.7 mA/V, C_ox 1.73 µF/cm², 1.46 eV at 850 nm, T_J 110 °C, 0.1 W. Differences point to the lesson to revisit.
Common mistakes
- Wrong: Applying np = n_i² out of equilibrium. — Right: Use quasi-Fermi levels under bias/light.
- Wrong: Using long-channel MOSFET equations for short channels. — Right: Include velocity saturation and DIBL.
- Wrong: Treating comparison-table values as universal. — Right: They depend on device and process.
Applications
- Revision: Exam and interview preparation.
- Design: Quick sanity checks.
- Teaching: Formula cards with assumptions.
- Search: Glossary lookup.
Key takeaways
- Each formula has assumptions and validity limits.
- Comparison tables give typical, process-dependent values.
- Use the glossary for quick definitions.
- Self-check by hand before trusting tools.
Going further
- Dimensional analysis: Check formulas by units.
- Validity limits: When each model breaks down.
- Constants table: Material parameters for Si, Ge, GaAs, GaN, SiC.