Junction Capacitance, Switching & Breakdown
Why a diode is not an ideal switch. Learn depletion (junction) capacitance C_j = εA/W and its reverse-bias dependence, the C–V method for doping profiling, diffusion (storage) capacitance from injected charge, the charge-control model, forward and reverse recovery (storage time t_s, t_rr, Q_rr, soft vs snappy recovery), and breakdown mechanisms — avalanche (impact ionisation) and Zener (band-to-band tunnelling) — their doping and temperature dependence, dynamic resistance, pulse/energy ratings and safe operation — with Python computing C_j(V), C_d, storage time and breakdown voltage vs doping.
A diode stores charge: the fixed charge of the depletion region (like a capacitor whose plate spacing changes with voltage) and the injected minority carriers under forward bias. Removing that charge takes time and current, limiting switching speed and causing losses in power converters.
At high reverse voltage the junction breaks down. Used deliberately (Zener and TVS diodes) or avoided (rectifiers, transistors), breakdown sets the voltage rating of every semiconductor device.
An analogy
A forward-biased diode is like a sponge soaked with water (stored minority carriers): when you suddenly reverse it, water keeps flowing out the wrong way until the sponge is squeezed dry — that's reverse recovery.
Two capacitances
Junction capacitance comes from depletion charge changing with voltage; it dominates in reverse bias and is small (pF). Diffusion capacitance comes from stored minority charge Q = τI; it dominates in forward bias and can be nF–µF. Both appear in small-signal models and determine high-frequency behaviour: above ~1/(2πr_dC) the diode stops rectifying efficiently.
Switching behaviour
Key effects:
- Turn-on: forward recovery overshoot while conductivity modulation builds (high di/dt)
- Turn-off: storage time + recovery time; Q_rr grows with I_F, di/dt and temperature
- Soft recovery reduces overshoot and EMI (tailored lifetime/doping profiles)
- Schottky and SiC Schottky diodes have almost no Q_rr (only capacitive charge)
- Lifetime control (Pt, Au, irradiation) trades V_F for speed
Breakdown mechanisms
Avalanche: carriers accelerated by high fields gain enough energy to create new electron–hole pairs (impact ionisation), multiplying current. It dominates above ~6–8 V (lightly doped junctions) with a positive temperature coefficient (more phonon scattering → higher BV at higher T). Zener: in heavily doped junctions (BV < ~5 V) the depletion layer is so thin that electrons tunnel directly from valence to conduction band; negative temperature coefficient. Near 5–6 V the two mechanisms mix, giving near-zero TC.
Practical breakdown and ratings
Planar junction curvature, surface charge and edges reduce BV below the parallel-plane value — terminations (guard rings, field plates, JTE, bevels) recover it. Devices are rated for repetitive peak reverse voltage (V_RRM), non-repetitive surge, avalanche energy (E_AS for MOSFETs), and pulse power (TVS). Breakdown itself is not destructive; excess energy (heating, current crowding, second breakdown) is.
Formulas
- Junction capacitance:
C_j = εA/W = C_j0/(1 + V_R/V_bi)^m (m = ½ abrupt, ⅓ graded) - Doping from C–V:
N = 2/(qεA²·d(1/C²)/dV) - Diffusion capacitance:
C_d = τ_T·I_D/(nV_T) - Storage time:
t_s ≈ τ·ln(1 + I_F/I_R) - Avalanche (one-sided):
BV ≈ ε_sE_crit²/(2qN) (≈ 60(E_g/1.1)^1.5(N/10¹⁶)^(−3/4) V) - Recovery loss:
P_rr ≈ Q_rr·V_R·f_sw (diode) + extra turn-on loss in the switch
Worked example: C_j at bias
Given: C_j0 20 pF, V_bi 0.8 V, abrupt, V_R 7.2 V
Find: C_j.
- 20/√(1 + 9)
Answer: 6.3 pF
Worked example: Diffusion capacitance
Given: τ 100 ns, I 5 mA
Find: C_d.
- 100e−9 × 5e−3/0.02585
Answer: 19.3 nF
Worked example: Recovery loss
Given: Q_rr 200 nC, V_R 400 V, 50 kHz
Find: P.
- 200e−9 × 400 × 50e3
Answer: 4 W
Reverse recovery waveform
i_D
I_F ──────┐
│ di/dt set by circuit
0 ───────┼─────────────────────────── t
│ storage (t_s) │ recovery
−I_RM ─────────────────────╲___╱── (soft) or sharp snap (ringing, EMI)
├──────── t_rr ────────────┤ Q_rr = area of negative currentAfter the current reverses, the junction stays forward-biased while stored minority carriers are removed (storage phase), then the depletion region forms and current returns to zero. Q_rr and the snappiness of the tail set switching loss and EMI in converters.
Capacitances, storage time and breakdown voltage
import math
# Junction and diffusion capacitance, reverse-recovery storage time and avalanche breakdown voltage
Cj0, Vbi, m = 10e-12, 0.75, 0.5
for Vr in (0, 1, 5, 20):
print(f"Cj at Vr = {Vr:2d} V: {Cj0/(1+Vr/Vbi)**m*1e12:.2f} pF")
tau, VT = 1e-6, 0.02585
for I in (1e-3, 10e-3):
print(f"diffusion capacitance at {I*1e3:.0f} mA (tau 1 us): {tau*I/VT*1e9:.1f} nF")
IF, IR = 1.0, 0.5
ts = tau * math.log(1 + IF / IR)
print(f"storage time for IF 1 A switched to IR 0.5 A: ts = tau*ln(1 + IF/IR) = {ts*1e6:.2f} us")
q, eps = 1.602e-19, 11.7 * 8.854e-14
for N, Ecrit in ((1e14, 2.0e5), (1e15, 3.0e5), (1e16, 4.0e5), (1e17, 6.0e5)):
BV = eps * Ecrit**2 / (2 * q * N)
print(f"one-sided junction, N = {N:.0e}: Ecrit ~ {Ecrit:.1e} V/cm -> BV ~ {BV:.0f} V")
# Cj at Vr = 0 V: 10.00 pF
# Cj at Vr = 1 V: 6.55 pF
# Cj at Vr = 5 V: 3.61 pF
# Cj at Vr = 20 V: 1.90 pF
# diffusion capacitance at 1 mA (tau 1 us): 38.7 nF
# diffusion capacitance at 10 mA (tau 1 us): 386.8 nF
# storage time for IF 1 A switched to IR 0.5 A: ts = tau*ln(1 + IF/IR) = 1.10 us
# one-sided junction, N = 1e+14: Ecrit ~ 2.0e+05 V/cm -> BV ~ 1293 V
# one-sided junction, N = 1e+15: Ecrit ~ 3.0e+05 V/cm -> BV ~ 291 V
# one-sided junction, N = 1e+16: Ecrit ~ 4.0e+05 V/cm -> BV ~ 52 V
# one-sided junction, N = 1e+17: Ecrit ~ 6.0e+05 V/cm -> BV ~ 12 VReverse bias halves the junction capacitance within a few volts (C ∝ 1/√V) — the basis of varactors. Diffusion capacitance is huge (tens of nF) under forward current and dominates switching. A 1 µs lifetime gives ~1.1 µs storage time. Breakdown voltage scales inversely with doping: kilovolt devices need ~10¹⁴ cm⁻³ drift layers, while 10¹⁷ doping breaks down near 12 V.
Common mistakes
- Wrong: Treating diodes as instant switches in SMPS. — Right: Include Q_rr and recovery losses.
- Wrong: Assuming breakdown is destructive. — Right: Energy/temperature destroys; controlled breakdown is fine.
- Wrong: Using parallel-plane BV for real devices. — Right: Edges lower BV; terminations required.
Applications
- Varactors: Voltage-tuned capacitance.
- Fast rectifiers: Low Q_rr for SMPS.
- Zener references: Controlled breakdown.
- C–V profiling: Measuring doping in wafers.
Key takeaways
- C_j = εA/W ∝ (V_bi + V_R)^(−m); C_d = τI/V_T.
- Stored charge causes storage time and Q_rr losses.
- Avalanche (> ~6 V, +TC) vs Zener (< ~5 V, −TC).
- BV ∝ N^(−3/4): high voltage needs light doping and thick layers.
Going further
- Ionisation integrals: Exact avalanche condition ∫α dx = 1.
- Dynamic avalanche: During fast switching of power devices.
- Deep-level transient spectroscopy: Trap measurement via capacitance.