Atomic & Crystal Structure of Semiconductors
From atoms to wafers. Learn atomic structure (protons, neutrons, electrons, atomic number, shells and valence electrons), covalent bonding in group-IV semiconductors, crystalline vs polycrystalline vs amorphous solids, lattice, unit cell and basis, the diamond-cubic (Si, Ge) and zinc-blende (GaAs) and wurtzite (GaN) structures, crystal planes and directions with Miller indices, wafer orientations (100)/(111), and crystal defects — vacancies, interstitials, substitutional impurities, dislocations, stacking faults and grain boundaries — and their effect on devices. Python computes silicon's atom density, mass density, bond length, plane densities and interplanar spacings.
Device behaviour starts with how atoms are arranged. Silicon's four valence electrons form four covalent bonds in a perfectly repeating 3-D lattice; this regularity creates the energy bands that make semiconductors work.
Crystal orientation affects oxidation rate, carrier mobility and etching, while defects create unwanted energy states that trap carriers and cause leakage.
An analogy
A crystal is like a perfectly tiled floor stretching for kilometres: each tile (unit cell) is identical, so you can describe the whole floor by one tile and the pattern. Defects are missing, extra or cracked tiles — each one a place where something can go wrong.
Atoms and bonding
An atom has a nucleus of protons (positive, count = atomic number Z) and neutrons, surrounded by electrons in shells. Chemistry and conduction are governed by the outermost (valence) electrons. Group IV elements (C, Si, Ge) have four valence electrons and form four covalent bonds; III-V compounds (Ga + As) share electrons to average four per atom.
Crystalline, polycrystalline, amorphous
Order matters:
- Single crystal — one continuous lattice: device wafers
- Polycrystalline — many grains separated by grain boundaries: poly-Si gates, solar cells
- Amorphous — short-range order only: a-Si thin-film transistors, SiO₂
- Grain boundaries scatter carriers and trap charge, lowering mobility
Miller indices
To name a plane, take its intercepts with the axes in units of a, invert them and clear fractions: a plane cutting x at 1 and parallel to y and z is (100). Directions [uvw] are vector components; in cubic crystals [hkl] is perpendicular to (hkl). Families use {100} and ⟨100⟩. Wafers are specified by surface orientation (e.g. (100)) and marked with flats or notches showing a ⟨110⟩ direction.
Defects
Point defects: vacancies, self-interstitials, substitutional impurities (dopants, intentionally) and unwanted metals (Fe, Cu, Au) that create deep traps. Line defects: dislocations (from thermal stress or lattice mismatch in epitaxy). Planar: stacking faults, grain boundaries, twin boundaries. Volume: precipitates (oxygen in Cz silicon, used for gettering). Defects increase leakage, reduce minority-carrier lifetime and cause reliability failures — hence clean rooms and gettering.
Formulas
- Atoms per unit cell (diamond):
8 corners×⅛ + 6 faces×½ + 4 inside = 8 - Atomic density:
N = 8/a³ (Si: 5.0 × 10²² cm⁻³) - Bond length:
d = √3·a/4 (Si: 2.35 Å) - Interplanar spacing (cubic):
d_hkl = a/√(h² + k² + l²) - Mass density:
ρ = N·M/N_A
Worked example: Miller indices
Given: Plane intercepts x = 1, y = 2, z = ∞
Find: (hkl).
- Reciprocals 1, ½, 0
- Clear fractions ×2
Answer: (210)
Worked example: GaAs atom density
Given: a = 5.653 Å, 8 atoms/cell
Find: N.
- 8/(5.653e−8)³
Answer: 4.43 × 10²² cm⁻³
Worked example: Spacing
Given: Si (220)
Find: d.
- 5.431/√8
Answer: 1.92 Å
From atom to device
Si atom (Z = 14): 1s² 2s² 2p⁶ 3s² 3p² → 4 valence electrons
│ sp³ bonding: each atom shares electrons with 4 neighbours (tetrahedral, 109.5°)
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Diamond-cubic lattice (two interpenetrating FCC lattices offset by a/4 along [111])
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Single-crystal ingot (Czochralski) → wafer sliced along (100) → devicesEach silicon atom completes an octet by sharing one electron with each of four neighbours. The diamond-cubic arrangement is FCC with a two-atom basis; GaAs has the same geometry with alternating Ga and As atoms (zinc blende), and GaN uses the hexagonal wurtzite structure.
Silicon lattice numbers
import math
# Silicon diamond-cubic lattice: atom density, mass density, bond length, plane densities and spacing
a = 5.431e-8 # lattice constant (cm)
N = 8 / a**3
print(f"atoms per cm^3 = 8/a^3 = {N:.3e}")
print(f"mass density = {N*28.0855/6.02214e23:.3f} g/cm^3")
print(f"nearest-neighbour (bond) distance = sqrt(3)*a/4 = {math.sqrt(3)*a/4*1e8:.3f} Angstrom")
planes = {"(100)": 2 / a**2, "(110)": 4 / (math.sqrt(2) * a**2), "(111)": 4 / (math.sqrt(3) * a**2)}
for p, d in planes.items():
print(f"surface atom density {p}: {d:.2e} atoms/cm^2")
for hkl in [(1, 0, 0), (1, 1, 0), (1, 1, 1)]:
d = a / math.sqrt(sum(i * i for i in hkl))
print(f"interplanar spacing d{hkl} = {d*1e8:.3f} Angstrom")
print(f"a 1 mm^3 cube holds {N*1e-3:.2e} atoms; a 1e16 cm^-3 doping replaces 1 atom in {N/1e16:.1e}")
# atoms per cm^3 = 8/a^3 = 4.994e+22
# mass density = 2.329 g/cm^3
# nearest-neighbour (bond) distance = sqrt(3)*a/4 = 2.352 Angstrom
# surface atom density (100): 6.78e+14 atoms/cm^2
# surface atom density (110): 9.59e+14 atoms/cm^2
# surface atom density (111): 7.83e+14 atoms/cm^2
# interplanar spacing d(1, 0, 0) = 5.431 Angstrom
# interplanar spacing d(1, 1, 0) = 3.840 Angstrom
# interplanar spacing d(1, 1, 1) = 3.136 Angstrom
# a 1 mm^3 cube holds 4.99e+19 atoms; a 1e16 cm^-3 doping replaces 1 atom in 5.0e+06Silicon packs 5 × 10²² atoms per cm³, giving 2.33 g/cm³. The (110) plane is the densest, (100) the sparsest — one reason (100) wafers give the lowest interface-trap density for MOSFETs while (111) was historically used for bipolar devices. A typical doping level replaces only one silicon atom in millions.
Common mistakes
- Wrong: Using Miller intercepts directly. — Right: Take reciprocals, then clear fractions.
- Wrong: Ignoring orientation in processing. — Right: Oxidation and etch rates depend on orientation.
- Wrong: Assuming defects are harmless in small numbers. — Right: Deep-level traps at 10¹¹ cm⁻³ already reduce lifetime.
Applications
- Wafer specification: Orientation, flats and notches.
- Epitaxy: Lattice matching (e.g. InGaAs on InP).
- Anisotropic etching: KOH etches (100) much faster than (111) — MEMS.
- Gettering: Trapping metal impurities away from devices.
Key takeaways
- Four valence electrons → four covalent bonds → diamond lattice.
- N = 8/a³; d_hkl = a/√(h² + k² + l²).
- Orientation affects oxidation, etching, mobility.
- Defects create traps, leakage and lifetime loss.
Going further
- Reciprocal lattice & Brillouin zone: Basis of band-structure calculations.
- Strain engineering: Strained Si/SiGe for mobility boost.
- X-ray diffraction: Measuring lattice constant and quality.